3M™ Novec™ Electronic Grade Coating, 1904

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Designed for moisture and corrosion protection of printed circuit boards and electronic components

Low surface energy allows lubricating oils, silicones, photoresist solutions, etc. to bead and drain freely from coated surfaces

Helps provide repellency and antiwetting properties against liquids – water, hydrocarbons, silicones, and photoresists

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Details

Highlights
  • Designed for moisture and corrosion protection of printed circuit boards and electronic components
  • Low surface energy allows lubricating oils, silicones, photoresist solutions, etc. to bead and drain freely from coated surfaces
  • Helps provide repellency and antiwetting properties against liquids – water, hydrocarbons, silicones, and photoresists
  • The polymer can endure up to 175°C for 24 hours and maintain repellency
  • Thermally and electrically stable with good dielectric properties
  • Non-flammable, non ozone-depleting, and low in toxicity
  • Excellent surface wetting, especially under low standoff SMT components

3M™ Novec™ Electrical Grade Coating 1904 is a fluorinated polymer diluted in a blend of 3M™ Novec™ Engineered Fluid 7100 and 3M™ Novec™ Engineered Fluid 7200, segregated hydrofluoroether solvents, providing a low viscosity, low surface tension coating solution.

Designed for moisture and corrosion protection of printed circuit boards and electronic components, it dries to an ultrathin, transparent coating with excellent hydrophobic and oleophobic properties. It does not need curing and is easy to apply. Novec 1904 coating is non-flammable, non ozone-depleting, low in toxicity, low in GWP, RoHS compliant, and VOC exempt (per U.S. EPA). Trust 3M™ Novec™ Electronic Grade Coating 1904 for conformal, waterproof coating on electronic circuits.

Suggested applications
  • Adheres to a variety of materials (metals, glass, ceramics, polymers, composites, laminates
  • Essentially insoluble in solvents such as heptanes, toluene & water
  • Easy to apply – dries quickly without the need for post-application curing

Specifications

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