3M™ Boron Nitride Cooling Fillers

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Helps improve thermal conductivity in polymers while maintaining or improving electrical insulation

Ideal for thermoplastic, elastomer, and thermoset resins

Used in a wide variety of electrical and electronic applications

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Details

Highlights
  • Helps improve thermal conductivity in polymers while maintaining or improving electrical insulation
  • Ideal for thermoplastic, elastomer, and thermoset resins
  • Used in a wide variety of electrical and electronic applications
  • Platelets: powders of highly crystalline single platelets
  • Agglomerates: soft, randomly-oriented aggregated platelets
  • Flakes: hard, oriented aggregated platelets

3M™ Boron Nitride Cooling Fillers are engineered to help improve thermal conductivity in polymers while maintaining or improving electrical insulation. Their unique properties make these additives beneficial for many thermoplastic, elastomer, and thermoset resins used in a wide variety of electrical and electronic applications — including thermal interface materials (TIM), 5G, consumer electronics, and automotive applications.

3M™ Boron Nitride Cooling Fillers are versatile ceramic materials offering thermal conductivity, temperature stability, low loss factor, chemical resistance, high reflectivity, lightweighting, and electrical insulation. The structure of layered hexagonal plates provides outstanding lubricating properties and is non-abrasive to tooling. 3M Boron Nitride products are manufactured at fully dedicated, ISO 9001- and 14001-certified facilities. These manufacturing processes are optimized for quality, efficiency, and consistency — helping ensure reliable and repeatable product performance.

Suggested applications
  • Thermal interface materials (TIM)
  • 5G
  • Consumer electronics
  • Automotive applications

Specifications

Resources