3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2

3M ID B40066386
  • Designed for 250°F (120°C) cure or 350°F (175°C)
  • Adhesive can be cured from 225°F (107°C) up to 350°F (175°C)
  • Excellent shop handling characteristics
  • Excellent pre-bond humidity performance on composite substrates
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Details
  • Designed for 250°F (120°C) cure or 350°F (175°C)
  • Adhesive can be cured from 225°F (107°C) up to 350°F (175°C)
  • Excellent shop handling characteristics
  • Excellent pre-bond humidity performance on composite substrates
  • Unsupported version available for reticulation
  • High-fracture toughness and peel strength

3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2 encompasses a family of thermosetting modified epoxy adhesives in film form that provides long-term durability and meets specific challenges for metal and composite solid panel and honeycomb sandwich construction, where high fracture toughness and peel strength is required.

3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2 provides excellent performance with easy-to-use shop handling properties. These adhesive films are available in a variety of weights and carriers to meet a range of needs without imposing excess material costs. With high fracture toughness and peel strength, this product provides a reliable, long-term bond suitable for composites, metals in solid panel and honeycomb sandwich fabrication. It is also compatible with multiple substrates and primers. In addition, 3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2 exhibits excellent pre-bond humidity performance on composite substrates.