3M™ Scotch-Weld™ Structural Adhesive Film AF 191

  • 3M ID B40066390

Designed for 350°F (175°C) cure

Adhesive can be cured from 275°F (135°C) up to 350°F (175°C)

Excellent elevated temperature performance

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Details

Highlights
  • Designed for 350°F (175°C) cure
  • Adhesive can be cured from 275°F (135°C) up to 350°F (175°C)
  • Excellent elevated temperature performance
  • Unsupported version available for reticulation
  • High-fracture toughness and peel strength
  • Available with lightweight conductive screen for lightning strike/composite surfacing

3M™ Scotch-Weld™ Structural Adhesive Film AF 191 encompasses a family of thermosetting modified epoxy adhesives in film form that provide long-term durability and meet specific challenges for metal and composite solid panel and honeycomb sandwich construction, where high fracture toughness and peel strength is required.

3M™ Scotch-Weld™ Structural Adhesive Film AF 191 provides excellent performance with easy-to-use shop handling properties. These adhesive films are available in a variety of weights and carriers to meet a range of needs without imposing excess material costs. With high fracture toughness and peel strength, this product provides a reliable, long-term bond suitable for composites, metals in solid panel and honeycomb sandwich fabrication. In addition, 3M™ Scotch-Weld™ Structural Adhesive Film AF 191 exhibits excellent pre-bond humidity performance on composite substrates.

Specifications