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  6. 3M™ Scotch-Weld™ Structural Adhesive Film, AF 126-2, .030wt, 36 in x 36 yd

3M™ Scotch-Weld™ Structural Adhesive Film, AF 126-2, .030wt, 36 in x 36 yd

3M ID 7000046456
  • Designed for structural bonding of metals
  • Cure at temperatures as low as 82°C / 180°F
  • High-tack for shop handling performance
  • Low flow during cure
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Specifications
Adhesive Type
Epoxy
Brand
Scotch-Weld™
Capabilities
Aircraft Maintenance & Production Efficiency
Colour Family
Green
Cure Rate
1 Hour
Cure Temperature
250 Degree Fahrenheit
Govt Markets Market Segment
Defense, Facilities Management
Govt Markets Product Category
Maintenance
Market Segment
Structures
Maximum Operating Temperature (Celsius)
80 °C
Maximum Operating Temperature (Fahrenheit)
176 °F
Minimum Operating Temperature (Fahrenheit)
-67 °F
National Stock Number
8030015857675, 8040012096296, 8040012167810, 8040012929648, 8040014756574
Nominal Adhesive Thickness (Imperial)
5 mil
Nominal Weight
0.03 Pound Force Per Square Foot
Overall Length (Imperial)
36 yd
Overall Length (Metric)
33 m
Overall Width (Imperial)
36 in
Overall Width (Metric)
1 m
Percent Volatile
<1 Percent
Product Colour
Green
Shear Strength
5000 psi
Shelf Life
3 mo
Size (Imperial)
36 in x 36 yd
Size (Metric)
1 m x 33 m
Storage Environment
Freezer Storage
Details
  • Designed for structural bonding of metals
  • Cure at temperatures as low as 82°C / 180°F
  • High-tack for shop handling performance
  • Low flow during cure
  • Low tack for easy handling

3M™ Scotch-Weld™ Structural Adhesive AF 126 is a thermosetting, toughened, non-volatile, modified epoxy film adhesive designed for structural bonding of metals.

3M™ Scotch-Weld™ Structural Adhesive AF 126 is specially designed for structural bonding of metals. It is able to cure at temperatures as low as 82°C / 180°F. This structural adhesive has excellent strength performance in metal-to-metal, composite, and honeycomb sandwich applications. It is low flow during cure and low tack for easy handling.

Suggested Applications

  • Metal-to-metal, composite, and honeycomb sandwich applications