3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is a low-viscosity adhesive for easy dispensing and potting. It is non-corrosive to copper, with minimal exotherm and very low shrinkage – making it well-suited for potting and bonding electronic and electrical components.
Our 3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is a rigid, two-part epoxy adhesive with a 1:1 mix ratio and 70°F minute work life. It provides initial strength in about 3 hours with approximately 2,500 PSI at 72°F (22°C). Additionally, our 3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is low viscosity for easy dispensing and potting, and is non-corrosive to copper. Epoxy adhesives are part of the class of adhesives called "structural adhesives" which include polyurethane, acrylic, cyanoacrylate, and others. Epoxies are formulated as liquid reactive polymers that undergo a chemical reaction when mixed and then cure to form a solid plastic material. Once the two parts are mixed in their specified ratio, they begin the curing process and offer a limited working time where the adhesive can be applied and the two surfaces positioned as needed. This work life lasts anywhere from a few minutes to several hours. These structural adhesives provide high shear and peel strengths, depending on the formula, and better heat and chemical resistance than other common adhesives. In general, epoxy adhesives have the highest overall strength and offer the best performance and most resistance to high temperatures, solvents, and outdoor weathering.