3M™ Scotch-Weld™ Structural Void Filling Compound EC-3505 B/A FR is a two-part, low-density, flame-retardant epoxy compound that can be stored, applied and cured at room temperature.
3M™ Scotch-Weld™ Structural Void Filling Compound EC-3505 B/A FR is a non-sag, non-brittle compound designed for void-filling, edge-sealing/close-out, corner reinforcement, local reinforcement for mechanical fixation and complex gap-filling in honeycomb sandwich structures. It cures to a strong, low-density material within 48 hours at 24°C (75°F) or 2 hour at 43°C (110°F). The thixotropic properties make application easy. It is sandable and machinable within 6 hours at 23°C (75°F) of mixing or 1 hour at 43°C (110°F). It is also paintable. The cured material meet flame resistance requirements of 14 CFR 25.853 (a) (d).