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  6. 3M™ Scotch-Weld™ Structural Void Filling Compound, EC-3505 B/A FR, 400 mL cartridge

3M™ Scotch-Weld™ Structural Void Filling Compound, EC-3505 B/A FR, 400 mL cartridge

3M ID 7000133728
  • Thixotropic
  • Excellent sag resistance
  • Cuts cycle time, as its sandable and machinable within 6 hours at 75°F (23.8°C) after mixing
  • Void filling
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Specifications
Adhesive Type
Epoxy
Application Life
60 min
Brand
Scotch-Weld™
Capabilities
Aircraft Maintenance & Production Efficiency
Chemical Base
Epoxy
Colour Family
Brown
Compressive Strength
15 MPa (2200 psi)
Container Size (Imperial)
400 mL
Cure Rate
48 Hours
Cure Temperature
Room Temperature
Density
0.44 g/cc
Flame Retardant
FR
Market Segment
Interiors
Meets Specifications
14 CFR-25.853(a)(d)
Product Colour
Light Brown
Product Form
Cartridge
Storage Environment
Refrigeration Storage
Time to Handling Strength
4 Hours
Worklife
60 minutes @ Room Temperature
Details
  • Thixotropic
  • Excellent sag resistance
  • Cuts cycle time, as its sandable and machinable within 6 hours at 75°F (23.8°C) after mixing
  • Void filling
  • Provides impact resistance
  • Paintable

3M™ Scotch-Weld™ Structural Void Filling Compound EC-3505 B/A FR is a two-part, low-density, flame-retardant epoxy compound that can be stored, applied and cured at room temperature.

3M™ Scotch-Weld™ Structural Void Filling Compound EC-3505 B/A FR is a non-sag, non-brittle compound designed for void-filling, edge-sealing/close-out, corner reinforcement, local reinforcement for mechanical fixation and complex gap-filling in honeycomb sandwich structures. It cures to a strong, low-density material within 48 hours at 24°C (75°F) or 2 hour at 43°C (110°F). The thixotropic properties make application easy. It is sandable and machinable within 6 hours at 23°C (75°F) of mixing or 1 hour at 43°C (110°F). It is also paintable. The cured material meet flame resistance requirements of 14 CFR 25.853 (a) (d).

Suggested Applications

  • Honeycomb sandwich structures